NEO Semiconductor Unveils 3D X-DRAM, A Promising Alternative to Traditional DRAM
US-based NEO Semiconductor has announced an innovative memory technology known as 3D X-DRAM, which aims to address the growing demands of high-density memory solutions, particularly for artificial intelligence applications. As first reported by Wccftech, this new architecture attempts to overcome traditional DRAM capacity limitations by employing a structure similar to NAND flash memory.